B540C-13 데이터 시트보기 (PDF) - Diodes Incorporated.
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B540C-13 Datasheet PDF : 3 Pages
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B520C - B560C
5.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
SPICE MODELS: B520C B530C B540C B550C B560C
Features
· Guard Ring Die Construction for Transient
Protection
· Ideally Suited for Automatic Assembly
· Low Power Loss, High Efficiency
· Surge Overload Rating to 175A Peak
· For Use in Low Voltage, High Frequency
Inverters, Free Wheeling, and Polarity
Protection Application
Mechanical Data
· Case: Molded Plastic
· Plastic Material - UL Flammability
Classification 94V-0
· Moisture sensitivity: Level 1 per J-STD-020A
· Terminals: Solder Plated Terminal
Solderable per MIL-STD-202, Method 208
· Also Available in Lead Free Plating (Matte Tin
Finish). Please see Ordering Information,
Note 4, on Page 2
· Polarity: Cathode Band or Cathode Notch
· Approx. Weight: 0.21 grams
· Marking: Type Number
B
A
C
D
J
H
G
E
SMC
Dim Min Max
A
5.59 6.22
B
6.60 7.11
C
2.75 3.18
D
0.15 0.31
E
7.75 8.13
G
0.10 0.20
H
0.76 1.52
J
2.00 2.62
All Dimensions in mm
Maximum Ratings and Electrical Characteristics @ TA = 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Symbol
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
RMS Reverse Voltage
VR(RMS)
Average Rectified Output Current
@ TT = 90°C
IO
Non-Repetitive Peak Forward Surge Current, 8.3 ms single
half-sine-wave Superimposed on Rated Load
IFSM
(JEDEC method)
Forward Voltage
@ IF = 5.0A DC
VFM
Peak Reverse Current
at Rated DC Blocking Voltage
@ TA = 25°C
@ TA = 100°C
IRM
Typical Total Capacitance (Note 2)
CT
Typical Thermal Resistance, Junction to Terminal (Note 1) RqJT
Typical Thermal Resistance, Junction to Ambient
RqJA
Operating Temperature Range
Tj
Storage Temperature Range
TSTG
B520C
20
14
B530C B540C B550C B560C
30
40
50
60
21
28
35
42
5.0
175
0.55
0.70
0.5
20
300
10
50
-55 to +125
-55 to +150
Unit
V
V
A
A
V
mA
pF
K/W
°C/W
°C
°C
Notes: 1. Thermal Resistance: Junction to terminal, unit mounted on PC board with 5.0 mm2 (0.013 mm thick) copper pads as heat sink.
2. Measured at 1.0 MHz and applied reverse voltage of 4.0V DC.
DS13012 Rev. 4 - 2
1 of 3
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B520C-B560C
ã Diodes Incorporated
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