X28HC256J-15HY 데이터 시트보기 (PDF) - Intersil
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X28HC256J-15HY Datasheet PDF : 17 Pages
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X28HC256
Ordering Information
PART NUMBER
ACCESS TIME TEMP. RANGE
PART MARKING
(ns)
(°C)
PACKAGE
PKG. DWG. #
X28HC256J-15*
X28HC256J-15 HY
0 to +70 32 Ld PLCC
N32.45x55
X28HC256JZ-15* (Note) X28HC256J-15 ZHY
0 to +70 32 Ld PLCC (Pb-free)
N32.45x55
X28HC256JI-15*, **
X28HC256JI-15 HY
-40 to +85 32 Ld PLCC
N32.45x55
X28HC256JIZ-15* (Note) X28HC256JI-15 ZHY
-40 to +85 32 Ld PLCC (Pb-free)
N32.45x55
X28HC256P-15****
X28HC256P-15 HY
0 to +70 28 Ld PDIP
E28.6
X28HC256PZ-15*** (Note) X28HC256P-15 HYZ
0 to +70 28 Ld PDIP (Pb-free)
E28.6
X28HC256PI-15****
X28HC256PI-15 HY
-40 to +85 28 Ld PDIP
E28.6
X28HC256PIZ-15*** (Note) X28HC256PI-15 HYZ
-40 to +85 28 Ld PDIP (Pb-free)
E28.6
X28HC256SI-15*
X28HC256SI-15 HY
-40 to +85 28 Ld SOIC (300 mil)
MDP0027
X28HC256SIZ-15 (Note) X28HC256SI-15 HYZ
-40 to +85 28 Ld SOIC (300 mil) (Pb-free)
MDP0027
X28HC256J-12*
X28HC256J-12 HY
0 to +70 32 Ld PLCC
N32.45x55
X28HC256JZ-12* (Note) X28HC256J-12 ZHY
0 to +70 32 Ld PLCC (Pb-free)
N32.45x55
X28HC256JI-12*
X28HC256JI-12 HY
-40 to +85 32 Ld PLCC
N32.45x55
X28HC256JIZ-12* (Note) X28HC256JI-12 ZHY
-40 to +85 32 Ld PLCC (Pb-free)
N32.45x55
X28HC256P-12****
X28HC256P-12 HY
0 to +70 28 Ld PDIP
E28.6
X28HC256PZ-12*** (Note) X28HC256P-12 HYZ
0 to +70 28 Ld PDIP (Pb-free)
E28.6
X28HC256PI-12****
X28HC256PI-12 HY
-40 to +85 28 Ld PDIP
E28.6
X28HC256PIZ-12*** (Note) X28HC256PI-12 HYZ
-40 to +85 28 Ld PDIP (Pb-free)
E28.6
X28HC256S-12
X28HC256S-12 HY
120
0 to +70 28 Ld SOIC (300 mils)
MDP0027
X28HC256SZ-12 (Note) X28HC256S-12 HYZ
0 to +70 28 Ld SOIC (300 mils) (Pb-free)
MDP0027
X28HC256SI-12
X28HC256SI-12 HY
-40 to +85 28 Ld SOIC (300 mils)
MDP0027
X28HC256SIZ-12 (Note) X28HC256SI-12 HYZ
-40 to +85 28 Ld SOIC (300 mils) (Pb-free)
MDP0027
X28HC256JZ-90* (Note) X28HC256J-90 ZHY
0 to +70 32 Ld PLCC (Pb-free)
N32.45x55
X28HC256JI-90*
X28HC256JI-90 HY
-40 to +85 32 Ld PLCC
N32.45x55
X28HC256JIZ-90* (Note) X28HC256JI-90 ZHY
-40 to +85 32 Ld PLCC (Pb-free)
N32.45x55
X28HC256P-90****
X28HC256P-90 HY
90
0 to +70 28 Ld PDIP
E28.6
X28HC256PZ-90*** (Note) X28HC256P-90 HYZ
0 to +70 28 Ld PDIP (Pb-free)
E28.6
X28HC256PIZ-90 (Note) X28HC256PI-90 HYZ
-40 to +85 28 Ld PDIP (Pb-free)
E28.6
X28HC256S-90
X28HC256S-90 HY
0 to +70 28 Ld SOIC (300 mils)
MDP0027
X28HC256SI-90
X28HC256SI-90 HY
-40 to +85 28 Ld SOIC (300 mils)
MDP0027
X28HC256SIZ-90 (Note) X28HC256SI-90 HYZ
-40 to +85 28 Ld SOIC (300 mils) (Pb-free)
MDP0027
*Add "T1" suffix for tape and reel.
**Add "T2" suffix for tape and reel.
***Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.
****Part at Prenotification (will become obsolete).
NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100%
matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil
Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
2
FN8108.3
September 21, 2011
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