MPX5700DP 데이터 시트보기 (PDF) - NXP Semiconductors.
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MPX5700DP
NXP Semiconductors.
MPX5700DP Datasheet PDF : 11 Pages
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Pressure
PACKAGE DIMENSIONS
C
B
J
S
M
-A-
R
NOTES:
1. DIMENSIONING AND TOLERANCING PER
POSITIVE PRESSURE
(P1)
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
PIN 1
SEATING
PLANE
-T-
1 2 3 45 6
N
L
G
F
D 6 PL
0.136 (0.005) M T A M
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 0.595 0.630 15.11 16.00
B 0.514 0.534 13.06 13.56
C 0.200 0.220 5.08 5.59
D 0.027 0.033 0.68 0.84
F 0.048 0.064 1.22 1.63
G 0.100 BSC
2.54 BSC
J 0.014 0.016 0.36 0.40
L 0.695 0.725 17.65 18.42
M
30˚ NOM
30˚ NOM
N 0.475 0.495 12.07 12.57
R 0.430 0.450 10.92 11.43
S 0.090 0.105 2.29 2.66
STYLE 1:
PIN 1. VOUT
2. GROUND
3. VCC
4. V1
5. V2
6. VEX
STYLE 2:
PIN 1. OPEN
2. GROUND
3. -VOUT
4. VSUPPLY
5. +VOUT
6. OPEN
STYLE 3:
PIN 1. OPEN
2. GROUND
3. +VOUT
4. +VSUPPLY
5. -VOUT
6. OPEN
CASE 867-08
ISSUE N
BASIC ELEMENT
PORT #1
POSITIVE
PRESSURE
(P1)
PORT #2
VACUUM
(P2)
SEATING
PLANE
-T-
P
0.25 (0.010) M T Q M
X
R
N
B
C
-T-
SEATING
PLANE
J
PIN 1
-A-
U
WL
V
1 2 34 5 6
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
PORT #2 VACUUM (P2)
PORT #1 POSITIVE
PRESSURE (P1)
-Q-
K
S
INCHES
DIM MIN MAX
A 1.145 1.175
B 0.685 0.715
C 0.405 0.435
D 0.027 0.033
F 0.048 0.064
G 0.100 BSC
J 0.014 0.016
K 0.695 0.725
L 0.290 0.300
N 0.420 0.440
P 0.153 0.159
Q 0.153 0.159
R 0.063 0.083
S 0.220 0.240
U 0.910 BSC
V 0.182 0.194
W 0.310 0.330
X 0.248 0.278
MILLIMETERS
MIN MAX
29.08 29.85
17.40 18.16
10.29 11.05
0.68 0.84
1.22 1.63
2.54 BSC
0.36 0.41
17.65 18.42
7.37 7.62
10.67 11.18
3.89 4.04
3.89 4.04
1.60 2.11
5.59 6.10
23.11 BSC
4.62 4.93
7.87 8.38
6.30 7.06
G
F
D 6 PL
0.13 (0.005) M A M
STYLE 1:
PIN 1. VOUT
2. GROUND
3. VCC
4. V1
5. V2
6. VEX
CASE 867C-05
ISSUE F
PRESSURE AND VACUUM SIDES PORTED (DP)
MPX5700
6
Sensors
Freescale Semiconductor, Inc.
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