PCF2123U/10AA/1 데이터 시트보기 (PDF) - NXP Semiconductors.
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PCF2123U/10AA/1 Datasheet PDF : 64 Pages
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NXP Semiconductors
PCF2123
SPI Real time clock/calendar
4. Ordering information
Table 1. Ordering information
Type number
Package
Name
PCF2123BS
HVQFN16
PCF2123TS
TSSOP14
PCF2123U/10AA
PCF2123U/12AA
PCF2123U/12HA
PCF2123U/5GA
wire bond die
WLCSP12
WLCSP12
wire bond die
Description
plastic thermal enhanced very thin quad flat package;
no leads; 16 terminals; body 3 3 0.85 mm
plastic thin shrink small outline package; 14 leads;
body width 4.4 mm
12 bonding pads
wafer level chip size package; 12 bumps
wafer level chip size package; 12 bumps
12 bonding pads
Version
SOT758-1
SOT402-1
PCF2123U/10
PCF2123U/12
PCF2123U/12
PCF2123U/10
4.1 Ordering options
Table 2. Ordering options
Product type number
Sales item (12NC)
PCF2123BS/1
PCF2123TS/1
PCF2123U/10AA/1
935286382512
935286382518
935286384112
935286384118
935287542005
PCF2123U/12AA/1
935290647005
PCF2123U/12HA/1
935292966005
PCF2123U/5GA/1
935295429015
Orderable part
number
IC
revision
PCF2123BS/1,512 1
PCF2123BS/1,518 1
PCF2123TS/1,112 1
PCF2123TS/1,118 1
PCF2123U/10AA/1,00 1
PCF2123U/12AA/1,00 1
PCF2123U/12HA/1,00 1
PCF2123U/5GA/1,015 1
Delivery form
tube, dry pack
tape and reel, 13 inch, dry pack
tube
tape and reel, 13 inch
sawn 6 inch wafer on Film Frame
Carrier (FFC) for 6 inch wafer
sawn 6 inch wafer on plastic Film
Frame Carrier (FFC) for 8 inch
wafer
sawn 6 inch wafer on plastic Film
Frame Carrier (FFC) for 8 inch
wafer
wafer, unsawn
5. Marking
Table 3. Marking codes
Type number
PCF2123BS
PCF2123TS
PCF2123U/10AA
PCF2123U/12AA
PCF2123U/12HA
PCF2123U/5GA
Marking code
123
PCF2123
PC2123-1
PC2123-1
PC2123-1
PC2123-1
PCF2123
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6 — 15 July 2013
© NXP B.V. 2013. All rights reserved.
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