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MPX4115AP 데이터 시트보기 (PDF) - Motorola => Freescale

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MPX4115AP Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
Freescale SemiconductorM, PIXn4c1.15A MPXA4115A SERIES
ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005
INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must
be the correct size to ensure proper solder connection inter-
face between the board and the package. With the correct
fottprint, the packages will self–align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and short-
ing between solder pads.
0.660
16.76
0.100 TYP 8X
2.54
0.060 TYP 8X
1.52
0.300
7.62
0.100 TYP 8X
2.54
inch
mm SCALE 2:1
Figure 5. SOP Footprint (Case 482)
Motorola Sensor Device Data For More Information On This Product,
5
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