DatasheetQ Logo
Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits

K4S560832E-NL 데이터 시트보기 (PDF) - Samsung

부품명
상세내역
제조사
K4S560832E-NL Datasheet PDF : 13 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
SDRAM 256Mb E-die (x4, x8)
AC OPERATING TEST CONDITIONS (VDD = 3.3V ± 0.3V, TA = 0 to 70°C)
Parameter
AC input levels (Vih/Vil)
Input timing measurement reference level
Input rise and fall time
Output timing measurement reference level
Output load condition
Value
2.4/0.4
1.4
tr/tf = 1/1
1.4
See Fig. 2
3.3V
Output
870
1200
VOH (DC) = 2.4V, IOH = -2mA
VOL (DC) = 0.4V, IOL = 2mA
50pF
Output
CMOS SDRAM
Unit
V
V
ns
V
Z0 = 50
Vtt = 1.4V
50
50pF
(Fig. 1) DC output load circuit
(Fig. 2) AC output load circuit
OPERATING AC PARAMETER
(AC operating conditions unless otherwise noted)
Parameter
Row active to row active delay
RAS to CAS delay
Row precharge time
Row active time
Row cycle time
Last data in to row precharge
Last data in to Active delay
Last data in to new col. address delay
Last data in to burst stop
Col. address to col. address delay
Number of valid output data
Symbol
tRRD(min)
tRCD(min)
tRP(min)
tRAS(min)
tRAS(max)
tRC(min)
tRDL(min)
tDAL(min)
tCDL(min)
tBDL(min)
tCCD(min)
CAS latency=3
CAS latency=2
Version
75
15
20
20
45
65
2
2 CLK + tRP
1
1
1
2
1
Unit
Note
ns
1
ns
1
ns
1
ns
1
us
ns
1
CLK
2
-
CLK
2
CLK
2
CLK
3
ea
4
Notes : 1. The minimum number of clock cycles is determined by dividing the minimum time required with clock cycle time
and then rounding off to the next higher integer.
2. Minimum delay is required to complete write.
3. All parts allow every cycle column address change.
4. In case of row precharge interrupt, auto precharge and read burst stop.
Rev. 1.1 February, 2004

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]