LM1117M3 데이터 시트보기 (PDF) - Cystech Electonics Corp.
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LM1117M3 Datasheet PDF : 8 Pages
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CYStech Electronics Corp.
SOT-89 Dimension
Spec. No. : C506M3
Issued Date : 2007.07.10
Revised Date :2015.05.13
Page No. : 8/8
A
123
C
B
D
E
F
G
Marking:
Device
Name
Date
H Code
1117□□□
□□□□
Vout:
1.5V→-15
1.8V→-18
2.5V→-25
3.3V→-33
5.0V→-50
ADJ→
blank
I
Style: Pin 1. GND/ADJ 2. VOUT 3. VIN
3-Lead SOT-89 Plastic
Surface Mounted Package
CYStek Package Code: M3
DIM
Inches
Min. Max.
A 0.1732 0.1811
B 0.1551 0.1673
C
0.0610 REF
D 0.0906 0.1024
E 0.0126 0.0205
Millimeters
Min. Max.
4.40 4.60
3.94 4.25
1.55 REF
2.30 2.60
0.32 0.52
DIM
Inches
Min. Max.
F
0.0591 TYP
G
0.1181 TYP
H 0.0551 0.0630
I 0.0138 0.0173
Millimeters
Min. Max.
1.50 TYP
3.00 TYP
1.40 1.60
0.35 0.44
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
Lead: Pure tin plated.
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
CYStek reserves the right to make changes to its products without notice.
CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
LM1117M3 series
CYStek Product Specification
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