NCS2003(2014) 데이터 시트보기 (PDF) - ON Semiconductor
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NCS2003 Datasheet PDF : 10 Pages
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NCS2003, NCV2003
PACKAGE DIMENSIONS
TSOP−5
CASE 483−02
ISSUE K
NOTE 5
2X 0.10 T
2X
0.20 T B 5
4
1 23
B
G
A
A
TOP VIEW
D 5X
0.20 C A B
S
M
K
DETAIL Z
C
0.05
H
SIDE VIEW
C
SEATING
PLANE
DETAIL Z
J
END VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION A.
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
MILLIMETERS
DIM MIN MAX
A
3.00 BSC
B
1.50 BSC
C 0.90 1.10
D 0.25 0.50
G
0.95 BSC
H 0.01 0.10
J 0.10 0.26
K 0.20 0.60
M
0 _ 10 _
S 2.50 3.00
SOLDERING FOOTPRINT*
0.95
0.037
1.9
0.074
2.4
0.094
1.0
0.039
0.7
0.028
ǒ Ǔ SCALE 10:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
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