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HLMP-CB2B-VW0DD 데이터 시트보기 (PDF) - Avago Technologies

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HLMP-CB2B-VW0DD
AVAGO
Avago Technologies AVAGO
HLMP-CB2B-VW0DD Datasheet PDF : 12 Pages
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Example of Wave Soldering Temperature Profile for TH LED
260°C Max
105°C Max
60 sec Max
Ammo Packs Drawing
6.35 ± 1.30
0.250 ± 0.051
TIME (sec)
12.70 ± 1.00
0.500 ± 0.039
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature: 255°C ± 5°C
(maximum peak temperature = 260°C)
Dwell time: 3.0 sec - 5.0 sec
(maximum = 5sec)
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
9.125 ± 0.625
0.3595 ± 0.0245
18.00 ± 0.50
0.7085 ± 0.0195
CATHODE
20.5 ± 1.00
0.8070 ± 0.0394
12.70 ± 0.30
0.500 ± 0.012
0.70 ± 0.20
0.0275 ± 0.0075 A
A
VIEW AA
Note: The ammo-packs drawing is applicable for packaging option –DD & -ZZ and regardless standoff or non-standoff
Ø
4.00
0.1575
±
±
0.20
0.0075
TYP.
10

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