NL37WZ07MU1TCG 데이터 시트보기 (PDF) - ON Semiconductor
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NL37WZ07MU1TCG Datasheet PDF : 11 Pages
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NL37WZ07
PACKAGE DIMENSIONS
UQFN8, 1.4x1.2, 0.4P
CASE 523AS
ISSUE A
D
A
B
PIN ONE
REFERENCE
2X
0.10 C
ÉÉÉÉ
E
2X
0.10 C TOP VIEW
0.05 C
DETAIL B (A3)
8X
0.05 C
A1
SIDE VIEW
L
L
L1
DETAIL A
ALTERNATE
CONSTRUCTIONS
A
ÉÇÉÇ EXPOSED Cu
MOLD CMPD
DETAIL B
ALTERNATE
CONSTRUCTION
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.25 mm FROM THE TERMINAL TIP.
MILLIMETERS
DIM MIN MAX
A 0.45 0.55
A1 0.00 0.05
A3 0.13 REF
b 0.15 0.25
D 1.40 BSC
E 1.20 BSC
e 0.40 BSC
L 0.20 0.40
L1 −−− 0.15
L2 0.30 0.50
C
SEATING
PLANE
SOLDERING FOOTPRINT*
L2 2
4
L
DETAIL A 1
8
e
6
6X b
0.10 M C A B
BOTTOM VIEW
0.05 M C NOTE 3
1.61
0.55
1
1.40
7X
0.45
8X 0.25
0.40
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
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