NL37WZ07MU1TCG 데이터 시트보기 (PDF) - ON Semiconductor

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NL37WZ07MU1TCG

Triple Buffer with Open Drain Outputs

ON Semiconductor 

NL37WZ07

PACKAGE DIMENSIONS

UDFN8, 1.95x1, 0.5P

CASE 517CA−01

ISSUE O

D

PIN ONE

ÉÉ REFERENCE

ÉÉÉÉ 2X

0.10 C

2X

0.10 C

TOP VIEW

0.05 C

0.05 C

SIDE VIEW

e/2

e

1

4

L1

AB

E

A3

A

A1

C

SEATING

PLANE

7X L

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.15 AND 0.20 MM FROM TERMINAL TIP.

4. PACKAGE DIMENSIONS EXCLUSIVE OF

BURRS AND MOLD FLASH.

MILLIMETERS

DIM MIN MAX

A 0.45 0.55

A1 0.00 0.05

A3 0.13 REF

b 0.15 0.25

D 1.95 BSC

E 1.00 BSC

e 0.50 BSC

L 0.25 0.35

L1 0.30 0.40

RECOMMENDED

SOLDERING FOOTPRINT*

7X

0.49

8X

0.30

1.24

8

5

BOTTOM VIEW

8X b

0.10 M

0.05 M

CAB

C NOTE 3

0.54

1

PKG

OUTLINE

0.50

PITCH

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

www.onsemi.com

9

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