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M24C16-X 데이터 시트보기 (PDF) - STMicroelectronics

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M24C16-X Datasheet PDF : 38 Pages
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M24C16, M24C08, M24C04, M24C02, M24C01
Description
Figure 2. 8-pin package connections (top view)
16Kb / 8Kb / 4Kb / 2Kb / 1Kb
NC / NC / NC / E0 / E0
NC / NC / E1 / E1 / E1
NC / E2 / E2 / E2 / E2
VSS
M24Cxx
1
8
2
7
3
6
4
5
VCC
WC
SCL
SDA
AI02034F
1. NC = Not connected
2. See Section 7: Package mechanical data for package dimensions, and how to identify pin-1.
3. The Ei inputs are not decoded, and are therefore decoded as “0” (See Section 2.3: Chip Enable (E0, E1,
E2) for more information).
Figure 3. WLCSP and thin WLCSP connections
(top view, marking side, with balls on the underside)
WC
VCC
SDA
SCL
VSS
ai14908
1. For devices of less than 16Kb (see Figure 2: 8-pin package connections (top view)), the Ei inputs are not
connected to a ball, therefore the Ei input is decoded as "0" (see also Section 2.3: Chip Enable (E0, E1,
E2))
Caution:
EEPROM dice delivered in wafer form or in WLCSP package by STMicroelectronics must
never be exposed to ultra violet (UV) light, since EEPROM cells loose their charge (and so
their binary value) when exposed to UV light.
Doc ID 5067 Rev 17
7/38

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