CAT24C32BC4 데이터 시트보기 (PDF) - ON Semiconductor
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CAT24C32BC4 Datasheet PDF : 11 Pages
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MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SCALE 4:1
WLCSP4, 0.77x0.77
CASE 567JY
ISSUE C
DATE 07 MAR 2017
E
ÈÈ PIN A1
REFERENCE
AB
D
TOP VIEW
DETAIL A
A2
0.05 C
NOTE 6
DIE COAT
(OPTIONAL)
A3
A2
A
0.05 C
NOTE 4 A1
SIDE VIEW
NOTE 3
C
SEATING
PLANE
DETAIL A
NOTE 5
4X b
0.05 C A B
B
0.03 C
A
e
e
12
BOTTOM VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DATUM C, THE SEATING PLANE, IS DEFINED BY THE
SPHERICAL CROWNS OF THE SOLDER BALLS.
4. COPLANARITY APPLIES TO SPHERICAL CROWNS OF
THE SOLDER BALLS.
5. DIMENSION b IS MEASURED AT THE MAXIMUM
CONTACT BALL DIAMETER PARALLEL TO DATUM C.
6. BACKSIDE COATING IS OPTIONAL.
MILLIMETERS
DIM MIN NOM MAX
A
−−−
−−− 0.35
A1 0.04 0.06 0.08
A2
0.23 REF
A3
0.025 REF
b 0.15 0.155 0.16
D 0.75 0.77 0.79
E 0.75 0.77 0.79
e
0.40 BSC
GENERIC
MARKING DIAGRAM*
X
YW
X = Specific Device Code
Y = Year
W = Work Week
RECOMMENDED
SOLDERING FOOTPRINT*
1
A
PACKAGE
OUTLINE
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
0.40
PITCH
4X
0.16
0.40
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER: 98AON85186F
Electronic versions are uncontrolled except when
STATUS: ON SEMICONDUCTOR STANDARD
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, 2D0E0S2 C− ReIPv.T0ION: WLCSP4, 0.77X0.77
“CONTROLLED COPY” in red.
http://onsemi.com
1
Case Outline Number:
PAGE 1 OFX2XX
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