CAV24C32(2016) 데이터 시트보기 (PDF) - ON Semiconductor
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CAV24C32 Datasheet PDF : 12 Pages
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CAV24C32
PACKAGE DIMENSIONS
D
PIN A1
ÈÈÈÈ REFERENCE
2X
0.05 C
AB
E
2X
0.05 C TOP VIEW
DETAIL A
A2
0.05 C
WLCSP4, 0.76x0.76
CASE 567JY
ISSUE O
DIE COAT
(OPTIONAL)
A3
A2
DETAIL A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
MILLIMETERS
DIM MIN MAX
A
−−− 0.35
A1 0.0415 0.0715
A2 0.255 REF
A3 0.025 REF
b 0.15 0.16
D
0.76 BSC
E
0.76 BSC
e
0.40 BSC
A
0.05 C
NOTE 3
A1
SIDE VIEW
C
SEATING
PLANE
RECOMMENDED
SOLDERING FOOTPRINT*
A1
PACKAGE
OUTLINE
4X b
0.05 C A B
B
0.03 C
A
e
e
12
BOTTOM VIEW
0.40
PITCH
4X
0.16
0.40
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
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