770-CS5511-400G 데이터 시트보기 (PDF) - Unspecified
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770-CS5511-400G Datasheet PDF : 2 Pages
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CS551
Specifications
SYSTEM
GRAPHICS
EXPANSION
AUDIO
ETHERNET
REAR I/O
INTERNAL I/O
WATCHDOG TIMER
SECURITY
POWER
OS SUPPORT
ENVIRONMENT
MECHANICAL
CERTIFICATIONS
Processor
Memory
BIOS
Controller
Feature
Display
Triple Displays
Interface
Audio Codec
Controller
Ethernet
USB
Display
Serial
USB
Display
Audio
SATA
DIO
Heater
SMBus
Output & Interval
TPM
Type
Connector
Consumption
RTC Battery
Microsoft
Linux
Temperature
Humidity
MTBF
Dimensions
Height
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One 260-pin SODIMM up to 32GB
Single Channel DDR4 2666MHz
C246 with ECC Support: Intel® Core i3-8100T/9100TE/Pentium
G5400T/Pentium G4900T
AMI SPI 128Mbit
Intel® UHD 630 Graphics GT Series
OpenGL 4.6, DirectX 12, OpenCL 2.1
HW Decode: AVC/H.264, MPEG2 (H.262), VC1, JPEG/MJPEG, HEVC/H.265, VP8, VP9, VP10
HW Encode: AVC/H.264, MPEG2 (H.262), JPEG/MJPEG, HEVC/H.265, VP8, VP9
1 x LVDS
2 x DP++
LVDS: resolution up to 1920x1200 @ 60Hz
DP++: resolution up to 4096x2304 @ 60Hz
LVDS + DP++ + DP++
1 x Full-size Mini PCIe (PCIe x1 up to Gen3/USB 2.0) (C246/Q370 opt.: USB 3.1 Gen1/USB 2.0)
1 x M.2 2280 M key (C246/Q370: NVMe PCIe x4/SATA 3.0; H310: NVMe PCIe x1/SATA 3.0)
1 x SIM slot (opt. for 3G/4G module)
Realtek ALC262
Intel® I211AT PCIe (10/100/1000Mbps) or Intel® I210IT PCIe (10/100/1000Mbps)
2 x GbE (RJ-45)
4 x USB 3.1 Gen2 (C246/Q370) or Gen1 (H310)
2 x DP++
1 x RS-232/422/485 (2.0mm pitch)
2 x USB 2.0 (2.0mm pitch)
1 x LVDS LCD Panel Connector
1 x LVDS Backlight
1 x Audio (Line-out/Mic-in)
1 x SATA 3.0 (up to 6Gb/s)
1 x SATA Power
1 x 8-bit DIO
1 x heater 12V header (wide temp. only)
1 x SMBus
System Reset, Programmable via Software from 1 to 255 Seconds
fTPM 2.0
12VDC
Vertical Type Connector (4-pin) (default) DC Jack (available upon request)
TBD
CR2032 Coin Cell
Windows 10 IoT Enterprise 64-bit RS1/RS5
Linux
Operating: -5 to 65°C for 35W/100C CPU (fanless); 35W 100C, 82C CPU (fan)
-30 to 80°C for 15W TDP down/100C CPU (fanless); 35W/100C CPU (fan)
Note: -30°C can add heater/polyfilm for mother board warm up.
Storage: -40 to 85°C
Operating: 5 to 90% RH
Storage: 5 to 90% RH
TBD
3.5" SBC Form Factor
146mm (5.75") x 102mm (4.02")
PCB: 1.6mm
Top Side: 16.3mm, Bottom Side: 4.0 mm
CE, FCC, RoHS
Ordering Information
Model Name
CS551-C246-BCA
CS551-H310-BCA
CS551-Q370-BCA
CS551-C246-ECA
CS551-H310-ECA
CS551-Q370-ECA
P/N
770-CS5511-000G
770-CS5511-100G
770-CS5511-200G
770-CS5511-300G
770-CS5511-400G
770-CS5511-500G
Memory
1 SODIMM
1 SODIMM
1 SODIMM
1 SODIMM
1 SODIMM
1 SODIMM
GbE
2
2
2
2
2
2
RS-232/422/485 USB 3.1 Gen2 USB 3.1 Gen1 USB 2.0 Power
1
4
0
2
12V
1
0
4
2
12V
1
4
0
2
12V
1
4
0
2
12V
1
0
4
2
12V
1
4
0
2
12V
Temp.
-5 to 65oC
-5 to 65oC
-5 to 65oC
-30 to 80°C
-30 to 80°C
-30 to 80°C
Packing List
Optional Items
• 1 CS551 board
• 1 COM port cable (Length: 250mm, 1 x COM port)
• 1 Serial ATA data cable (Length: 500mm)
• 1 Serial ATA power cable (Length: 250mm)
332-753040-000G
332-553001-005G
A81-004041-016G
• USB port cable (Length: 200mm)
• Power adapter (100W, 12V)
• 4 pin to DC jack cable (Length: 100mm)
• Audio cable (Length: 160mm)
• Cooler fan (Height: 34.6mm)
• Heat sink (Height: 43mm)
• Heater
A81-001032-016G
671-110006-100G
A81-004051-016G
A81-022007-016G
A71-101303-000G
A71-001302-000G
TBD
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DFI reserves the right to change the specifications at any time prior to the product's release. Changes thereafter will be based on the product's revision. Please contact your sales
representative for the exact revision offered in your area. All product names mentioned are trademarks of their respective companies. © August 19, 2020 DFI Inc.
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