GRM219R11E474JA88 데이터 시트보기 (PDF) - Murata Manufacturing
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GRM219R11E474JA88 Datasheet PDF : 30 Pages
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Substrate Bending test
・Test substrate
Material : Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness : 1.6mm (GRM02/GRM03/GRM15: t:0.8mm)
Copper foil thickness : 0.035mm
: Solder resist
(Coat with heat resistant resin for solder)
Land b
f4.5
a
100
Type
GRM02
GRM03
GRM15
GRM18
GRM21
GRM31
GRM32
Dime*n1s,2io：n2(.m0±m0).05
4.0±0.1
a
b
c φ1.
5
+
-
0.1
0
＊1 ＊2
0.2
0.56
0.23
0.3
0.9
0.3
0.4
Ａ 1.5
0.5
1.0
3.0
1.2
1.2
4.0
1.65
2.2
5.0
2.00.05以下
2.2
5.0
2.9
t
Fig.1 (in mm)
・TKeinsdt souf bSsotrldaeter : Sn-3.0Ag-0.5Cu
・TPeresst surbizsatrtaioten method
50 min.
20
Pressurization
speed
1.0mm/s
Pressurize
tor
R5
Support
Capacitance meter
45
45
Flexure
Fig.2
(in mm)
Adhesive Strength of Termination, Vibration, Temperature Sudden Change, Resistance to Soldering Heat (Reflow method)
High Temperature High Humidity(Steady) , Durability
・Test substrate
Material : Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness : 1.6mm or 0.8mm
Copper foil thickness : 0.035mm
・TKeinsdt souf bSsotrldaeter : Sn-3.0Ag-0.5Cu
・TLeasntdsDubimsternasteions
Chip Capacitor
a
b
Land
Solder Resist
Type
GRM02
GRM03
GRM15
GRM18
GRM21
GRM31
GRM32
Fig.3
Dimension (mm)
a
b
c
0.2
0.56
0.23
0.3
0.9
0.3
0.4
1.5
0.5
1.0
3.0
1.2
1.2
4.0
1.65
2.2
5.0
2.0
2.2
5.0
2.9
JEMCGS-0001U
5
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