WS2812B-MINI 데이터 시트보기 (PDF) - Unspecified

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WS2812B-MINI

Intelligent external control LED Integrated light source

Unspecified 

2.3. Management after unpacking

WS2812B-Mini

Intelligent external control LED

Integrated light source

It’s recommend to perform SMT assembly as soon as possible after opening the moisture-proof bag, and reflow

soldering should be completed within 4 hours after SMT assembly; for the remaining LEDs, they should be

re-packed in seal package and placed in moisture-proof cabinet (Please note that it’s necessary to rebake at

“70℃-75℃/48 hours” before next SMT process).

3. Dehumidification Operation (Non-leakage of air, baking temperature:70℃-75℃)

a. MD within 2 weeks, baking time: 24 hours.

b. MD exceeds 2 weeks, baking time: 48 hours.

4. Management of secondary SMT process

It’s necessary to do moisture-proof treatment when the secondary reflow carried out that followed the first reflow.

It can’t be more than 2 hours to be exposed at condition of “<30℃/60%RH” and dehumification operation is

requested for a longer interval reflow. For instance, place in a drying box or a container with desiccant, and

dehumidify it before the secondary reflow(Low temperature baking operation: 70℃-75℃, ≥12 hours).

5. SMT Reflow

Refer to the parameters listed below, the experimental results prove that the TOP SMD LED meets the JEDEC

J-STD-020C standards. As a general guideline, it is recommended to follow the SMT reflow temperature curve

recommended by the solder paste manufacturer.

Curve Description

The lowest preheat temperature (Tsmin)

The highest preheat temperature (Tsmax)

Preheating time (Tsmin to Tsmax) (ts)

Average rate of temperature rise (Tsmax to Tp)

LIQUID REGION temperature (TL)

LIQUID REGION Holding Time (tL)

Peak Temperature (Tp)

High Temperature Region(Tp=-5℃) Holding

TCiomoelin(tgp)Rate

Room Temperature to Peak Holding Time

Lead-free

R1e5f0l℃ow

200℃

60-180 S

<3℃/S

217℃

60-150 S

240℃

<10 S

<6℃/S

<6 min

Remarks: 1. These general guidelines may not apply to all PCB designs and reflow soldering configurations.

2. All temperatures referred are measured on the surface of the package body.

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