NPN Transistor Bare Die – MPSH10
VHF / UHF RF transistor in bare die form Complement PNP MPSH81
Rev 1.0
02/09/17
Features:
High fT min = 650MHz
Maximum capacitance 0.7pF
High Reliability Gold Back Metal
High Reliability tested grades for Military + Space
Die Dimensions in µm (mils)
360 (14.17)
70
(2.76)
Ordering Information:
The following part suffixes apply:
No suffix - MIL-STD-750 /2072 Visual Inspection
“H” - MIL-STD-750 /2072 Visual Inspection
+ MIL-STD-38534 Class H LAT
“K” - MIL-STD-750 /2072 Visual Inspection
+ MIL-STD-38534 Class K LAT
LAT = Lot Acceptance Test.
For further information on LAT process flows see below.
www.siliconsupplies.com\quality\bare-die-lot-qualification
BE
BE
E = EMITTER B = BASE
DIE BACK = COLLECTOR
Supply Formats:
Mechanical Specification
Default – Die in Waffle Pack (400 per tray capacity)
Sawn Wafer on Tape – Specific request
Unsawn Wafer – Specific request
With additional electrical selection – Specific request
Sawn as pairs or adjacent pair pick – Specific request
Die Size
(Excluding Saw Street)
Emitter & Base Pad Size
Die Thickness
Top Metal Composition
Back Metal Composition
360 x 250
µm
14.17 x 9.84 mils
70 x 70
µm
2.95 x 3.74 mils
180 (±20)
µm
7.09 (±0.79) mils
Al - 1.3µm
AuAs - 0.9µm
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