HMC331 데이터 시트보기 (PDF) - Hittite Microwave
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HMC331 Datasheet PDF : 4 Pages
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Outline Drawing
2
v04.1007
HMC331
GaAs MMIC PASSIVE FREQUENCY
DOUBLER, 12 - 18 GHz INPUT
Die Packaging Information [1]
Standard
Alternate
GP-5 (Gel Pack)
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. DIE THICKNESS IS .004”
3. TYPICAL BOND IS .004” SQUARE
4. BACKSIDE METALLIZATION: GOLD
5. BOND PAD METALLIZATION: GOLD
6. BACKSIDE METAL IS GROUND.
7. CONNECTION NOT REQUIRED FOR
UNLABELED BOND PADS.
Pad Description
Pad Number
Function
1
RFIN
Description
DC coupled and matched to 50 Ohm.
Interface Schematic
2
RFOUT
DC coupled and matched to 50 Ohm.
Die Bottom
GND
Die bottom must be connected to RF/DC ground.
2 - 24
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
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