LG1626DXC 데이터 시트보기 (PDF) - Agere -> LSI Corporation

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LG1626DXC

Modulator Driver

Agere -> LSI Corporation 

Data Sheet

February 1999

Outline Diagram

LG1626DXC Modulator Driver

0.465

0.280

1

1

LUCENT

LG1626DXC

XXXXXXX

0.012

0.030

0.082

0.005

0 — 0.004

Assembly Notes:

0.092

0.035

0.045

12-3224(F).a

Standoff specifications applies to package prior to solder dipping of leads and package base.

During board assembly use back lighting to silhouette the package. This will eliminate reflection problems with the

solder on the bottom of the package.

Lead space tolerance should be set to ± 0.012 in.

Board solder pattern for the package base should not exceed 50% of the package base area.

Insertion pressure should not exceed 125 grams.

LG1626DXC Ordering Information

Device

LG1626DXC

Type

24-Pin Package

Lucent Technologies Inc.

Comcode Number

108192865

9

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