3NF06L(2002) 데이터 시트보기 (PDF) - STMicroelectronics
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3NF06L Datasheet PDF : 8 Pages
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STN3NF06L
THERMAL DATA
Rthj-pcb Thermal Resistance Junction-PCB (*)
Max
38
Rthj-pcb Thermal Resistance Junction-PCB (**)
Max
100
Tl
Maximum Lead Temperature For Soldering Purpose
Typ
260
(for 10 sec. 1.6 mm from case)
(*) When Mounted on FR-4 board with 1 inch2 pad, 2 oz of Cu and t [ 10 sec
(**) When Mounted on minimum footprint
ELECTRICAL CHARACTERISTICS (Tcase = 25 °C unless otherwise specified)
OFF
Symbol
Parameter
Test Conditions
Min. Typ.
V(BR)DSS
Drain-source
Breakdown Voltage
ID = 250 µA, VGS = 0
60
IDSS
Zero Gate Voltage
Drain Current (VGS = 0)
VDS = Max Rating
VDS = Max Rating TC = 125°C
IGSS
Gate-body Leakage
Current (VDS = 0)
VGS = ± 16 V
°C/W
°C/W
°C
Max.
1
10
±100
Unit
V
µA
µA
nA
ON (*)
Symbol
VGS(th)
RDS(on)
Parameter
Gate Threshold Voltage
Static Drain-source On
Resistance
Test Conditions
VDS = VGS
ID = 250 µA
VGS = 10 V
VGS = 5 V
ID = 1.5 A
ID = 1.5 A
Min.
1
Typ.
0.07
0.085
Max.
2.8
0.10
0.12
Unit
V
Ω
Ω
DYNAMIC
Symbol
gfs (*)
Ciss
Coss
Crss
Parameter
Forward Transconductance
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
Test Conditions
VDS = 15 V
ID = 1.5 A
VDS = 25V, f = 1 MHz, VGS = 0
Min.
Typ.
3
340
63
30
Max.
Unit
S
pF
pF
pF
2/8
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