ITF86182SK8T 데이터 시트보기 (PDF) - Intersil

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ITF86182SK8T

11A, 30V, 0.0115 Ohm, P-Channel, Logic Level, Power MOSFET

Intersil 

ITF86182SK8T

Intersil provides thermal information to assist the designer’s

preliminary application evaluation. Figure 20 defines the

RθJA for the device as a function of the top copper

(component side) area. This is for a horizontally positioned

FR-4 board with 1oz copper after 1000 seconds of steady

state power with no air flow. This graph provides the

necessary information for calculation of the steady state

junction temperature or power dissipation. Pulse

applications can be evaluated using the Intersil device Spice

thermal model or manually utilizing the normalized maximum

transient thermal impedance curve.

Displayed on the curve are RθJA values listed in the

Electrical Specifications table. The points were chosen to

depict the compromise between the copper board area, the

thermal resistance and ultimately the power dissipation,

PDM.

Thermal resistances corresponding to other copper areas

can be obtained from Figure 20 or by calculation using

Equation 2. RθJA is defined as the natural log of the area

times a coefficient added to a constant. The area, in square

inches is the top copper area including the gate and source

pads.

RθJA = 83.2 – 23.6 × ln (Area)

(EQ. 2)

240

ln RθJA = 83.2 - 23.6* (AREA)

200

189oC/W - 0.0115in2

160

152oC/W - 0.054in2

120

80

0.01

0.1

1.0

AREA, TOP COPPER AREA (in2)

FIGURE 20. THERMAL RESISTANCE vs MOUNTING PAD AREA

The transient thermal impedance (ZθJA) is also effected by

varied top copper board area. Figure 21 shows the effect of

copper pad area on single pulse transient thermal

impedance. Each trace represents a copper pad area in

square inches corresponding to the descending list in the

graph. Spice and SABER thermal models are provided for

each of the listed pad areas.

Copper pad area has no perceivable effect on transient

thermal impedance for pulse widths less than 100ms. For

pulse widths less than 100ms the transient thermal

impedance is determined by the die and package. Therefore,

CTHERM1 through CTHERM5 and RTHERM1 through

RTHERM5 remain constant for each of the thermal models. A

listing of the model component values is available in Table 1.

150

COPPER BOARD AREA - DESCENDING ORDER

0.04 in2

120 0.28 in2

0.52 in2

0.76 in2

90 1.00 in2

60

30

0

10-1

100

101

102

103

t, RECTANGULAR PULSE DURATION (s)

FIGURE 21. THERMAL RESISTANCE vs MOUNTING PAD AREA

7

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