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ADCMP607BCPZ-WP 데이터 시트보기 (PDF) - Analog Devices

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ADCMP607BCPZ-WP Datasheet PDF : 14 Pages
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Data Sheet
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
ADCMP606/ADCMP607
Q1
6Q
ADCMP606
VEE 2 TOP VIEW 5 VCCI/VCCO
(Not to Scale)
VP 3
4 VN
Figure 3. ADCMP606 Pin Configuration
Table 5. ADCMP606 (6-Lead SC70) Pin Function Descriptions
Pin No.
Mnemonic
Description
1
Q
Noninverting Output. Q is at logic high if the analog voltage at the noninverting input, VP, is greater than
the analog voltage at the inverting input, VN.
2
VEE
Negative Supply Voltage.
3
VP
Noninverting Analog Input.
4
VN
Inverting Analog Input.
5
VCCI/VCCO
Input Section Supply/Output Section Supply. Shared pin.
6
Q
Inverting Output. Q is at logic low if the analog voltage at the noninverting input, VP, is greater than the
analog voltage at the inverting input, VIN.
VCCO 1
9 VEE
ADCMP607
VCCI 2
TOP VIEW
8 LE/HYS
VEE 3
7 SDN
NOTES
1. EXPOSED PAD. IF CONNECTED, THE EPAD MUST BE CONNECTED TO VEE.
THE METALLIC BACK SURFACE OF THE PACKAGE IS ELECTRICALLY
CONNECTED TO VEE. IT CAN BE LEFT FLOATING BECAUSE PIN 3, PIN 5,
PIN 9, AND PIN 11 PROVIDE ADEQUATE ELECTRICAL CONNECTION. IT CAN
ALSO BE SOLDERED TO THE APPLICATION BOARD IF IMPROVED THERMAL
AND/OR MECHANICAL STABILITY IS DESIRED.
Figure 4. ADCMP607 Pin Configuration
Table 6. ADCMP607 (12-Lead LFCSP) Pin Function Descriptions
Pin No.
Mnemonic
Description
1
VCCO
Output Section Supply.
2
VCCI
Input Section Supply.
3, 5, 9, 11
VEE
Negative Supply Voltage.
4
VP
Noninverting Analog Input.
6
VN
Inverting Analog Input.
7
SDN
Shutdown. Drive this pin low to shut down the device.
8
LE/HYS
Latch/Hysteresis Control. Bias with resistor or current for hysteresis adjustment; drive low to latch.
10
Q
Inverting Output. Q is at logic low if the analog voltage at the noninverting input, VP, is greater than the
analog voltage at the inverting input, VN, if the comparator is in compare mode.
12
Q
Noninverting Output. Q is at logic high if the analog voltage at the noninverting input, VP, is greater than
the analog voltage at the inverting input, VN, if the comparator is in compare mode.
EPAD
Exposed Pad. If connected, the EPAD must be connected to VEE. The metallic back surface of the package
is electrically connected to VEE. It can be left floating because Pin 3, Pin 5, Pin 9, and Pin 11 provide
adequate electrical connection. It can also be soldered to the application board if improved thermal
and/or mechanical stability is desired.
Rev. C | Page 7 of 14

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