SSD1850 데이터 시트보기 (PDF) - Solomon Systech
부품명
상세내역
제조사
SSD1850 Datasheet PDF : 56 Pages
| |||
DIE PAD ARRANGEMENT (SSD1851Z DIE PIN ASSIGNMENT)
157
COM17
COM16
156
COM15
COM14
COM13
COM12
COM11
COM5
COM4
COM3
COM2
COM1
COM0
ICONS
SEG0
SEG1
SEG2
SEG3
SEG4
SEG5
SEG6
SEG7
SEG8
SEG9
SEG10
SEG11
SEG12
SEG13
SEG117
SEG118
SEG119
SEG120
SEG121
SEG122
SEG123
SEG124
SEG125
SEG126
SEG127
COM32
COM33
COM35
COM36
COM37
COM38
COM39
COM40
COM41
COM42
COM43
COM45
COM46
COM47
COM48
COM49
COM50
COM51
COM52
COM53
COM54
COM56
COM57
COM58
323 324
SSD1850/51 Series Rev 1.2
01/2003
NC
NC
NC
CL
VSS
VR
132 131
VR
VL6
VL6
VL6
VL5
VL5
VL5
VL4
VL4
VL4
VL3
VL3
VL3
VL2
VL2
VL2
VSS
C4P
C4P
C4P
C2N
C2N
C2N
C2N
C2P
C2P
C2P
C1P
C1P
C1P
C1N
C1N
C1N
C1N
C3P
C3P
C3P
C5P
C5P
C5P
VCC
VCC
VCC
VCC
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VCI
VCI
VCI
VCI
VDD
VDD
VDD
D7
D7
D6
D6
D5
D4
D3
D2
D1
D0
VDD
E(RD#)
E(RD#)
R/W(/WR#)
R/W(/WR#)
VSS
D/C
D/C
D/C
RES#
VDD
CS#
CS#
VSS
PS1
VDD
VSS
PS0
347
VDD
S5150
1 VSS
N/C
N/C
N/C
N/C
N/C
X
Center (-5243.7, -522.3)
Size: 78.5 x 78.5
X
Center (-5309.85, -522.3)
Size: 78.5 x 78.5
18 µm 75
X µm
(-5508.0, 765.0)
18 µm 75
X µm
(5508.0, 765.0)
Note:
1.
2.
3.
4.
The gold bumps face up in this
diagram.
Coordinates reference to center of the
chip.
All dimensions and coordinates in um.
All alignment keys do not contain gold
bump.
Die Size:
Die Thickness:
Bump Height:
Tolerance
12300um x 1960um
534um +/- 25 um
Nominal 18 um
< 3 um within die
Center (5328.75, 84.3)
Size: 78.5 x 78.5
SSD1851Z Die Pin Assignment
DRAWING NOT SCALE
PIN #1
7
SOLOMON
Share Link: 