ADJD-E622-QR999 데이터 시트보기 (PDF) - Avago Technologies

부품명

상세내역

제조사

ADJD-E622-QR999

RGB Color Sensor in QFN Package

Avago Technologies 

16 Lead QFN Recommended PCB Land Pad Design

IPC-SM-782 is used as the standard for the PCB land-

pad design. Recommended PCB finishing is gold plated.

16 Lead QFN Recommended Stencil Design

A stencil thickness of 2.18mm (6mils) for this QFN

package is recommended.

0.4 mm

5.5 mm

3.19 mm

3.19 mm

0.8 mm

0.4 mm

0.8 mm

0.8 mm

3.9

5.5 mm

Figure 8.

2.18mm

Figure 7.

Recommendations for Handling and Storage of ADJD E622 QR999

This product is qualified as Moisture Sensitive Level 3 per Jedec J-STD-020. Precautions when handling this

moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application

Note AN5305 Handling Of Moisture Sensitive Surface Mount Devices for details.

A. Storage before use

- Unopened moisture barrier bag (MBB) can be stored at 30°C and 90%RH or less for maximum 1 year

- It is not recommended to open the MBB prior to assembly (e.g. for IQC)

- It should also be sealed with a moisture absorbent material (Silica Gel) and an indicator card (cobalt chloride)

to indicate the moisture within the bag

B. Control after opening the MBB

- The humidity indicator card (HIC) shall be read immediately upon opening of MBB

- The components must be kept at <30°C/60%RH at all time and all high temperature related process including

soldering, curing or rework need to be completed within 168hrs

C. Control for unfinished reel

- For any unused components, they need to be stored in sealed MBB with desiccant or desiccator at <5%RH

D. Control of assembled boards

- If the PCB soldered with the components is to be subjected to other high temperature processes, the PCB

need to be stored in sealed MBB with desiccant or desiccator at <5%RH to ensure no components have

exceeded their floor life of 168hrs

E. Baking is required if:

- “10%” or “15%” HIC indicator turns pink

- The components are exposed to condition of >30°C/60%RH at any time.

- The components floor life exceeded 168hrs

- Recommended baking condition (in component form): 125°C for 24hrs

10

Share Link: