ADP130 데이터 시트보기 (PDF) - Analog Devices
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ADP130 Datasheet PDF : 20 Pages
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ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
VIN to GND
VBIAS to GND
EN to GND
VOUT to GND
Storage Temperature Range
Operating Temperature Range
Operating Junction Temperature
Lead Temperature (Soldering, 10 sec)
Rating
−0.3 V to +3.6 V
−0.3 V to +6 V
−0.3 V to +6 V
−0.3 V to VIN
−65°C to +150°C
−40°C to +125°C
125°C
300°C
Stresses above those listed under absolute maximum ratings
may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or
any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL DATA
Absolute maximum ratings apply only individually, not in combi-
nation. The ADP130 may be damaged when junction temperature
limits are exceeded. Monitoring ambient temperature does not
guarantee that the junction temperature is within the specified
temperature limits. In applications with high power dissipation
and poor thermal resistance, the maximum ambient temperature
may need to be derated. In applications with moderate power
dissipation and low PCB thermal resistance, the maximum ambient
temperature can exceed the maximum limit as long as the junction
temperature is within specification limits. The junction tempera-
ture (TJ) of the device is dependent on the ambient temperature
(TA), the power dissipation of the device (PD), and the junction-to-
ambient thermal resistance of the package (θJA). TJ is calculated
using the following formula:
TJ = TA + (PD × θJA)
ADP130
The junction-to-ambient thermal resistance (θJA) of the package
is based on modeling and calculation using a four-layer board.
The junction-to-ambient thermal resistance is highly dependent
on the application and board layout. In applications where high
maximum power dissipation exists, close attention to thermal
board design is required. The value of θJA may vary, depending on
PCB material, layout, and environmental conditions. The specified
values of θJA are based on a four-layer, 4 in × 3 in circuit board.
For details about board construction, refer to JEDEC JESD51-7.
ΨJB is the junction-to-board thermal characterization parameter
with units of °C/W. ΨJB of the package is based on modeling and
calculation using a four-layer board. The JEDEC JESD51-12
document, Guidelines for Reporting and Using Package Thermal
Information, states that thermal characterization parameters are
not the same as thermal resistances. ΨJB measures the component
power flowing through multiple thermal paths rather than a single
path, as in thermal resistance (θJB). Therefore, ΨJB thermal paths
include convection from the top of the package as well as radiation
from the package, factors that make ΨJB more useful in real world
applications. Maximum junction temperature (TJ) is calculated
from the board temperature (TB) and power dissipation (PD), using
the following formula:
TJ = TB + (PD × ΨJB)
Refer to the JEDEC JESD51-8 and JESD51-12 documents for
more detailed information about ΨJB.
THERMAL RESISTANCE
θJA and ΨJB are specified for the worst-case conditions, that is, a
device soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type
θJA
ΨJB
5-Lead TSOT
170
43
Unit
°C/W
ESD CAUTION
Rev. 0 | Page 5 of 20
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