LT5521 데이터 시트보기 (PDF) - Linear Technology

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LT5521

Very High Linearity Active Mixer

Linear Technology 

APPLICATIO S I FOR ATIO

LT5521

Figure 17. Top View of Demo Board

PACKAGE DESCRIPTIO

UF Package

16-Lead Plastic QFN (4mm × 4mm)

(Reference LTC DWG # 05-08-1692)

4.35 ± 0.05 2.15 ± 0.05

(4 SIDES)

2.90 ± 0.05

0.72 ±0.05

4.00 ± 0.10

(4 SIDES)

PIN 1

TOP MARK

(NOTE 6)

0.75 ± 0.05

2.15 ± 0.10

(4-SIDES)

BOTTOM VIEW—EXPOSED PAD

R = 0.115

TYP

15 16

0.55 ± 0.20

1

2

PACKAGE

OUTLINE

0.30 ±0.05

0.65 BSC

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

0.200 REF

0.00 – 0.05

NOTE:

1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGC)

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION

ON THE TOP AND BOTTOM OF PACKAGE

(UF) QFN 1103

0.30 ± 0.05

0.65 BSC

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-

tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.

5521f

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