AMIS-30522(2009) 데이터 시트보기 (PDF) - ON Semiconductor

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AMIS-30522
(Rev.:2009)

Micro-Stepping Motor Driver

ON Semiconductor 

AMIS−30522, NCV70522

PACKAGE THERMAL CHARACTERISTICS

The 522 is available in a NQFP32 package. For cooling

optimizations, the NQFP has an exposed thermal pad which

has to be soldered to the PCB ground plane. The ground

plane needs thermal vias to conduct the heat to the bottom

layer. Figure 3 gives an example for good power distribution

solutions.

For precise thermal cooling calculations the major

thermal resistances of the device are given. The thermal

media to which the power of the devices has to be given are:

• Static environmental air (via the case)

• PCB board copper area (via the exposed pad)

The thermal resistances are presented in Table 5: DC

Parameters.

The major thermal resistances of the device are the Rth

from the junction−to−ambient (Rthja) and the overall Rth

from the junction−to−exposed pad (Rthjp). In the table

below one can find the values for the Rthja and Rthjp,

simulated according to JESD−51:

The Rthja for 2S2P is simulated conform JEDEC JESD−51

as follows:

• A 4−layer printed circuit board with inner power planes

and outer (top and bottom) signal layers is used

• Board thickness is 1.46 mm (FR4 PCB material)

• The 2 signal layers: 70 mm thick copper with an area of

5500 mm2 copper and 20% conductivity

• The 2 power internal planes: 36 mm thick copper with

an area of 5500 mm2 copper and 90% conductivity

The Rthja for 1S0P is simulated conform JEDEC JESD−51

as follows:

• A 1−layer printed circuit board with only 1 layer

• Board thickness is 1.46 mm (FR4 PCB material)

• The layer has a thickness of 70 mm copper with an area

of 5500 mm2 copper and 20% conductivity

ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎNÎÎÎÎQFPÎÎÎÎ−32ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

Figure 3. Example of NQFP−32 PCB Ground Plane Layout in Top View (Preferred Layout at Top and Bottom)

ELECTRICAL SPECIFICATION

Recommended Operation Conditions

Operating ranges define the limits for functional

operation and parametric characteristics of the device. Note

that the functionality of the chip outside these operating

Table 4. OPERATING RANGES

Symbol

Parameter

VBB

Analog DC supply

VDD

Logic supply output voltage

TJ

Junction temperature

5. No more than 100 cumulative hours in life time above Ttw

ranges is not guaranteed. Operating outside the

recommended operating ranges for extended periods of time

may affect device reliability.

Min

Max

Unit

+6

+30

V

4.75

5.25

V

−40

+172 (Note 5)

°C

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