PT2303 데이터 시트보기 (PDF) - Princeton Technology

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PT2303

2W × 2 Class AB Audio Power Amplifier

Princeton Technology 

Tel: 886-2-66296288

Fax: 886-2-29174598

URL: http://www.princeton.com.tw

2W × 2 Class AB Audio Power Amplifier

PT2303

HEAT DISSIPATION

During normal operation, the chip only consumes very little stand-by current. In high output power

conditions, the package temperature will rise. For proper operating temperature, a modest heat sink

mounted on the top side of the chip is required. The thermal resistance requirement of the heat sink

demand may be obtained by the formula below:

θJA = (TJ (max) - TA)/PDISS

PDISS = IC dissipation power

TJ (max) = Maximum chip conjunction temperature

TA = external environment temperature

θJA = thermal resistance from chip conjunction to ambience environment

With 60% estimated efficiency (eff), PT2303 in 2W + 2W output power dissipation is probably

PDISS = ( Po ÷ eff ) - Po = 2.6W

The maximum chip conjunction temperature is 150℃, Exceed this temperature will damage the chip,

assuming the outside environment air temperature is 50℃. From the chip conjunction dissipation to

external environment thermal resistance θJA should be:

θJA = ( 150 – 50 ) ÷ 2.6 = 38.4℃/W

The PT2303 chip conjunction to case thermal resistance θJC is 26℃ /W. Therefore the heat sink

thermal resistance should be:

θJA - θJC = 12.4℃/W

In normal operating, PT2303 needs at least 2 sq inch PCB for heat dissipate; it should be use whole

copper foil to cover on it for enough heat dissipation space. We suggest using two-layer PCB for better

heat dissipation. The track connected to the output and power pin of IC should be as thick as possible

for better heat dissipation ability. If IC doesn’t have enough heat dissipation space (>1 sq inch), and IC

is always in full power output situation, an additional heat sink should placed on the chip.

PT2303 V1.2

-6-

December, 2007

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