STPS2H100UY 데이터 시트보기 (PDF) - STMicroelectronics
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STPS2H100UY Datasheet PDF : 9 Pages
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STPS2H100-Y
Characteristics
Figure 11. Forward voltage drop versus
forward current (high level)
100 IFM(A)
Tj=125°C
(Maximum values)
Tj=125°C
(Typical values)
10
Tj=25°C
(Maximum values)
VFM(V)
1
0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8
Figure 12. Thermal resistance junction to
ambient versus copper surface
under each lead (SMA)
Rth(j-a)(°C/W)
130
120
110
Epoxy printed circuit board FR4,
Copper thickness = 35 µm
100
90
80
70
60
50
40
30
20
10
SCU(cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
SMA
4.5 5.0
Figure 13.
Thermal resistance junction to ambient versus copper surface under each lead (SMB)
Rth(j-a)(°C/W)
110
100
Epoxy printed circuit board FR4,
SMB
Copper thickness = 35 µm
90
80
70
60
50
40
30
20
10
SCU(cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Doc ID 17944 Rev 1
5/9
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