STPS40170C-Y
Characteristics (curves)
Figure 7. Forward voltage drop versus forward current
(per diode, low level)
20 IFM(A)
18
16
Tj = 125 °C
(Maximum values)
14
12
Tj = 125 °C
10
(Typical values)
8
6
4
Tj = 25 °C
(Maximum values)
2
0
VFM(V)
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
Figure 8. Forward voltage drop versus forward current
(per diode, high level)
1000 IFM(A)
100
10
Tj = 125 °C
(Maximum values)
Tj = 125 °C
(Typical values)
Tj = 25 °C
(Maximum values)
VFM(V)
1
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
Figure 9. Thermal resistance junction to ambient versus copper surface under tab
80 Rth(j-a) (°C/W)
Epoxy printed circuit board copper thickness = 35 µm
70
60
50
40
30
20
10
0
0
5
10
15
20
25
30
D²PAK
SCu(cm²)
35
40
DS6956 - Rev 2
page 4/9