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FDS3680 데이터 시트보기 (PDF) - Fairchild Semiconductor

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FDS3680
Fairchild
Fairchild Semiconductor Fairchild
FDS3680 Datasheet PDF : 5 Pages
1 2 3 4 5
Electrical Characteristics
Symbol
Parameter
TA = 25°C unless otherwise noted
Test Conditions
Min Typ Max Units
Drain-Source Avalanche Ratings (Note 2)
WDSS
Single Pulse Drain-Source
Avalanche Energy
VDD = 50 V,
ID = 5.2 A
IAR
Maximum Drain-Source Avalanche
Current
Off Characteristics
BVDSS
Drain–Source Breakdown Voltage VGS = 0 V, ID = 250 µA
BVDSS
===TJ
IDSS
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
ID = 250 µA, Referenced to 25°C
VDS = 80 V, VGS = 0 V
IGSSF
Gate–Body Leakage, Forward
VGS = 20 V, VDS = 0 V
IGSSR
Gate–Body Leakage, Reverse
VGS = –20 V, VDS = 0 V
245 mJ
5.2
A
100
101
V
mV/°C
10
µA
100 nA
–100 nA
On Characteristics (Note 2)
VGS(th)
Gate Threshold Voltage
VGS(th)
===TJ
RDS(on)
Gate Threshold Voltage
Temperature Coefficient
Static Drain–Source
On–Resistance
ID(on)
On–State Drain Current
gFS
Forward Transconductance
VDS = VGS, ID = 250 µA
ID = 250 µA, Referenced to 25°C
2
2.4
4
V
–6.5
mV/°C
VGS = 10 V, ID = 5.2 A
32
46
m
VGS = 10 V, ID = 5.2 A, TJ=125°C
VGS = 6 V, ID = 4.5 A
61 92
34 51
VGS = 10 V,
VDS = 5 V
25
A
VDS = 5 V,
ID = 5.2 A
25
S
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
VDS = 50 V,
f = 1.0 MHz
V GS = 0 V,
1735
pF
176
pF
53
pF
Switching Characteristics
td(on)
Turn–On Delay Time
tr
Turn–On Rise Time
td(off)
Turn–Off Delay Time
tf
Turn–Off Fall Time
Qg
Total Gate Charge
Qgs
Gate–Source Charge
Qgd
Gate–Drain Charge
(Note 2)
VDD = 50 V,
VGS = 10 V,
ID = 1 A,
RGEN = 10
VDS = 50 V,
VGS = 10 V
ID = 6 A,
14 25
ns
8.5 17
ns
63 94
ns
21 34
ns
38 53
nC
8.1
nC
9.2
nC
Drain–Source Diode Characteristics and Maximum Ratings
IS
Maximum Continuous Drain–Source Diode Forward Current
VSD
Drain–Source Diode Forward
Voltage
VGS = 0 V, IS = 2.1 A (Note 2)
2.1
A
0.73 1.2
V
Notes:
1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design.
a) 50°C/W when
mounted on a 1in2
pad of 2 oz copper
Scale 1 : 1 on letter
size paper
b) 105°C/W when
mounted on a 0.04
in2 pad of 2 oz
copper
c) 125°C/W when mounted on a
minimum pad.
FDS3680 Rev C (W)

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