BD829 데이터 시트보기 (PDF) - Philips Electronics
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BD829 Datasheet PDF : 8 Pages
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Philips Semiconductors
NPN power transistors
Product specification
BD825; BD829
PACKAGE OUTLINE
Plastic single-ended leaded (through hole) package; with cooling fin, mountable to heatsink,
1 mounting hole; 3 leads (in-line)
E1
P
c1
P1
SOT128B
HE
L2
L1
123
bp
e1
e
E
wM
D
L
c
Q
A
0
5
10 mm
DIMENSIONS (mm are the original dimensions)
scale
UNIT A
bp
c
c1
D
E
E1
e
e1
HE
L
L1
L2(1)
max
P
P1
Q
w
mm
4.6
4.4
0.8
0.6
0.65 0.56
0.5 0.46
8.6
8.4
10.1 10.4
9.9 10.0
5.08
2.54
24.2
23.8
13.3
12.2
2.4
2.0
2.5
3.8
3.6
3.9
3.7
1.7 0.25
1.5
Note
1. Plastic flash allowed within this zone
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
SOT128B
TO-202
97-02-28
1998 May 29
5
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