NXP Semiconductors
BYV410-600
Enhanced ultrafast dual rectifier diode
5. Thermal characteristics
Table 5.
Symbol
Rth(j-mb)
Thermal characteristics
Parameter
thermal resistance from
junction to mounting base
Rth(j-a)
thermal resistance from
junction to ambient
Conditions
with heatsink compound; per diode;
see Figure 3
with heatsink compound; both diodes
conducting
Min Typ Max Unit
-
-
2.4 K/W
-
-
1.6 K/W
-
60
-
K/W
10
Zth(j-mb)
(K/W)
1
001aag912
10−1
10−2
P
tp
δ=
T
10−3
10−6
10−5
10−4
10−3
10−2
10−1
tp
t
T
1
10
tp (s)
Fig 3. Transient thermal impedance from junction to mounting base per diode as a function of pulse width
BYV410-600_1
Product data sheet
Rev. 01 — 29 June 2009
© NXP B.V. 2009. All rights reserved.
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