MT46H16M32LF 데이터 시트보기 (PDF) - Micron Technology

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MT46H16M32LF

Mobile Low-Power DDR SDRAM

Micron Technology 

512Mb: x16, x32 Mobile LPDDR SDRAM

Package Dimensions

Figure 7: 90-Ball VFBGA (8mm x 13mm), Package Code: B5

90X Ø0.45

Dimensions apply to

solder balls post-reflow

on Ø0.40 SMD ball pads.

Solder ball material:

SAC305 (96.5% Sn, 3% Ag,

0.5% Cu) OR

SAC105 (98.5% Sn, 1% Ag,

0.5% Cu).

987

11.2 CTR

13 ±0.1

0.8 TYP

A

Ball A1 ID

(covered by SR)

32 1

A

B

C

D

E

F

G

H

J

K

L

M

N

P

R

0.8 TYP

6.4 CTR

8 ±0.1

Note: 1. All dimensions are in millimeters.

Seating plane

0.12 A

0.9 ±0.1

0.275 MIN

Ball A1 ID

PDF: 09005aef83dd2b3e

t67m_512mb_mobile_lpddr.pdf - Rev. H 06/13 EN

16

Micron Technology, Inc. reserves the right to change products or specifications without notice.

© 2009 Micron Technology, Inc. All rights reserved.

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