MT46H16M16 데이터 시트보기 (PDF) - Micron Technology

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MT46H16M16

Mobile DDR SDRAM

Micron Technology 

256Mb: x16, x32 Mobile DDR SDRAM

Package Dimensions

Package Dimensions

Figure 50: 60-Ball VFBGA Package

Seating

plane

0.1 A

A

0.65 ±0.05

0.3 ±0.025

60x Ø0.45

Dimensions apply

to solder balls

post-reflow. The

pre-reflow balls are

Ø0.42 on Ø0.4 SMD

ball pads.

3.6

7.2

0.8 TYP

8 ±0.1

98 7

4 ±0.05

321

Ball A1 ID

A

B

C 4.5 ±0.05

D

E

9 ±0.1

F

G

H

J

K

Solder ball material:

SAC105 (98.5% Sn, 1% Ag, 0.5% Cu)

Substrate material: plastic laminate

Mold compound: epoxy novolac

Micron logo

to be lased

ball A1 ID

0.8 TYP

3.2

6.4

Note: All dimensions are in millimeters.

1.0 MAX

PDF: 09005aef82091978 / Source: 09005aef8209195b

MT46H16M16LF__2.fm - Rev. H 6/08 EN

78

Micron Technology, Inc., reserves the right to change products or specifications without notice.

©2005 Micron Technology, Inc. All rights reserved.

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