MT46H16M16 데이터 시트보기 (PDF) - Micron Technology

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MT46H16M16

Mobile DDR SDRAM

Micron Technology 

Figure 51: 90-Ball VFBGA Package

256Mb: x16, x32 Mobile DDR SDRAM

Package Dimensions

0.65 ±0.05

Seating

plane

A

0.1 A

90X 0.45

Dimensions apply

to solder balls post-

reflow. Pre-reflow

balls are Ø0.42 on

Ø0.4 SMD ball pads.

987

8 ±0.1

4 ±0.05

Ball A1 ID

321

5.6

11.2

0.8 TYP

A

B

C

D

E

F

G

H

13 ±0.1

J

K

L

M

6.5 ±0.05

N

P

R

3.2

6.4

0.8 TYP

Solder ball material:

SAC105 (98.5% Sn, 1%Ag, 0.5% Cu)

Substrate material: plastic laminate

Mold compound: epoxy novolac

Ball A1 ID

1.0 MAX

Note: All dimensions are in millimeters.

®

8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900

prodmktg@micron.com www.micron.com Customer Comment Line: 800-932-4992

Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of

their respective owners.

This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth

herein. Although considered final, these specifications are subject to change, as further product development and data

characterization sometimes occur.

PDF: 09005aef82091978 / Source: 09005aef8209195b

MT46H16M16LF__2.fm - Rev. H 6/08 EN

79

Micron Technology, Inc., reserves the right to change products or specifications without notice.

©2005 Micron Technology, Inc. All rights reserved.

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